Upgraded K1170
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Specifications
Technical Specification
Main control module
(1)CPU:Intel® Xeon®Silver Ice Lake-SP 4310 Processor
(2)Memory: DDR4-2667;
(3)Hard disk: 500G HDD;
(4)Graphics card: Integrated;
(5)NIC: Intel® Ethernet X710-AT2 and I350-AM4
(6)Sound card: integrated high quality sound card.Object Display Booth
(1)Camera pixels: 2 million pixels, IP HD camera;
(2) Shooting range: 110cm*65cm;
(3)Focus mode: 18 optical zoom, auto focus.External camera
(1)Camera pixels: 2 million pixels, IP HD camera;
(2)Interface: HD-SDI; RJ-45; audio input\output;
(3)Major stream ratio: 1920 x 1080, 1280 x 720, 1024 x 576;
(4)Video codec standard: H.264/H.26/MJEPG;
(5)Power: ≦ 3.5W;
(6)Input voltage\current: DC 12V\1.0A. -
Features
Product Feature
- Modular functional components, parts can be conveniently assembled and disassembled to simplify equipment upgrade and maintenance.
- Tightly coupled modular circuit design makes the unit more stable.
- Customized motherboard and OPS control cables makes the unit more compact, lighter, safer, and easier to install and deploy.
- Redesigned software with uniformed functional interfaces is easier to use.
- High cost performance intelligence integration
- Easy to use intelligent operations
- Professional & convenient intelligent maintenance
- Convenient for later user to upgrade